Payment & Shipping Terms:
|Model:||RF-H800I||Heating Zone Length （mm):||2932|
|Running / Starting Power (kw):||8.5 / 33||Control:||PLC + PC|
|Temp Range:||Room Temperature ~ 320C||Machine Dimension (mm):||5150*1490*1510mm|
|Weight (kg):||Approx.2100||Temp Deviation:||± 2C|
|Conveyor Speed （mm/min ):||20-1500||PCB Width （mm):||50 - 400 ( Or Customized )|
|Options Available:||450/500 Max PCB Width Central Support For Big PCB Extra Cooling Zone||Parts Height:||On Baoard 35mm / Under Board 20mm|
8 Zone SMT Reflow Oven,
5150*1490*1510mm SMT Reflow Oven,
8 Zone Reflow Oven
5150*1490*1510mm 8 Zone SMT Reflow Oven PCB Production Line
PCB New Style Reflow Oven 8 Zone for SMT Line Production Line
PC + Siemens PLC control system,accurate temperaturecontrol and more stable,ensures temperature stability rate to be more than 99.99%
Hot Air System:
first-class heating module, the best temperature zone,interval design makes optimum temperature uniformity and repeat. The effectiveutilization and thermal compensation efficiency,it needs less than 20 minutesfrom temperature control accuracy t 1 'C ambient temperature to a temperature stabilization.
Windows interface, traditional and simplified Chinese and English online free switch, and operator password management,easy to operate.Operation records, temperature curve measurement and analysis functions, virtual simulation, fault self-diagnosis, process monitoring,automatic generate and save process control documents, substrate transportdynamic display.
New cooling zone, quick and easy adjustment, easilyreach the cooling requirements of different slopes.
We using third-party over-temperatureprotection, multiple layers protection to ensure safe operation.
The principle of reflow soldering is divided into several descriptions:
A. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, and covers the solder The pads isolate the pads and component pins from oxygen.
B. When the PCB enters the heat preservation zone, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature zone and damaging the PCB and components.
C. When the PCB enters the soldering area, the temperature rises rapidly to make the solder paste reach a molten state, and the liquid solder wets, diffuses, diffuses, or reflows to the PCB pads, component ends and pins to form solder joints.
D. The PCB enters the cooling zone and the solder joints are solidified; when the reflow soldering is completed.
Product Specification of Reflow Oven
|Heating Zone Length (mm)||2932|
|Running / Starting Power (kw)||8.5 / 33|
|Control||PLC + PC|
|Temp Range||Room Temperature ~ 320C|
|Machine Dimension (mm)||5150*1490*1510|
|Temp Deviation||± 2C|
|Conveyor Speed (mm/min )||20-1500|
|Mesh Belt Width ( mm )||460 ( or Customized )|
|PCB Width (mm)||50 - 400 ( or customized )|
|Cooling Type||Forced-air Coooling|
|Options Available||450/500 max PCB width
Central support for big PCB
Extra cooling zone
|Temp Accuracy||± 1C|
|Cooling Zone length ( mm )||600|
|Conveyor Type||Chain and Mesh Belt|
|Parts Height||On Baoard 35mm / Under Board 20mm|
|Power Supply||3P/AC 380V OR 3P/AC 220V|
The Pictures Showing of Reflow Oven
Contact Person: IVY