Payment & Shipping Terms:
|Heating Zone Length:||2650mm||PCB Width:||50-400 Mm|
|OEM Service:||Available||Payment Term:||L/C, T/T, Etc.|
|Dimension:||5000*1300*1450 Mm||Conveyor Speed:||20-1500 Mm/min|
|Lead Time:||15- 20 Working Days||Running Power:||9KW|
|Temp Range:||-320℃||Control:||PLC + Computer|
9KW SMT PCB Reflow Oven,
PLC SMT PCB Reflow Oven,
8 Zones Desktop Reflow Oven
SMT Reflow Oven
Lead Free SMT PCB Reflow Oven Equipment for Production Line 8 Zones
Product Parameter of Reflow Oven
|No. of Heating Zones||Top 8 & Bottom 8|
|Cooling Method||Air Oven : Forced Air;
Nitrogen Oven : Water Chiller
|Temperature Control Precision||± 1C|
|No. of Cooling Zones||2|
|Conveyor Height||900± 20 MM|
|Temp. Setting Range||Rome Temperature ~320C|
|Temperature Deviation on PCB||± 1.5C|
|Max. Width of PCB||50 ~ 400 MM|
|PCB Conveyor Method||Mesh and Rails|
|Nozzle Plate||Stainless Steel Plate|
|Startup Power||Approx. 33KW|
|Normal Operation Power||About 9KW|
|Length of Heating Zones||2950 MM|
|Power Supply||380V 50HZ / 220V 60HZ|
|Dimension ( L*W*H )||5000*1300*1450|
|Mesh Width||450 MM|
|Components Clearance||Top / Bottom Clearance of PCB is 25mm|
The Function of Reflow Oven
The function of reflow oven is to send the mounted circuit board of the SMT components
into the SMT reflow oven chamber. After high temperature, the solder paste used for
soldering the SMD components is melted by the process of high temperature hot air to
form a reflow temperature change, so that the SMD components and The pads on the
circuit board are combined and then cooled together.
The Features of Reflow Oven Equipment
★ Using PLC Control, with brand CPU, Original Windows XP system, 18 inch display,
to ensure the stability and reliability of the control system.
★ Powerful control software,with flexible parameter control and temperature profile test
function,language switch change anytime.
★ Using WAGO terminal blocks,all important electrical parts are imported brands,
all signal wires are shielded.
★ All heating zone controlled by PID, heating zones separate control, work alone to
reduce the starting power.
★ Using the world's leading hot air circulation heating mode, the high-efficiency pressurizing
acceleration duct, greatly improve the circulation of hot air flow, fast heating
(about 20 minutes), thermal compensation efficiency is high, can be high temperature
welding and solidified.
★ Separate temperature sensor in each zone , real-time monitoring and compensation in
each temperature zone temperature balance.
★ Supercharged fan structure and special-shaped heater design, no noise, no vibration,
has the extremely high heat exchange rate,temperature difference between the bottom
of BGA and PCB board, most meet with lead-free process strict requirements, especially
for the highly difficult welding lead free product requirements.
The Pictures Showing of Reflow Oven
Contact Person: Ivan Zhu