Payment & Shipping Terms:
|Cooling Method:||Air Oven : Forced Air; Nitrogen Oven : Water Chiller||Dimension ( L*W*H ):||5700*1300*1450|
|No. Of Cooling Zones:||2||Conveyor Direction:||Option|
|Temperature Control Precision:||± 1C||No. Of Heating Zones:||Top10 & Bottom 10|
|Normal Operation Power:||About 11KW||Temperature Deviation On PCB:||± 1.5C|
|Components Clearance:||Top / Bottom Clearance Of PCB Is 25mm||Convryor Speed:||20-2000MM/ Min|
11KW Lead Free Reflow Oven,
2000mm/ Min Lead Free Reflow Oven,
10 Zones Benchtop Reflow Oven
SMT Reflow Oven
Lead Free 10 Zones Reflow Oven Euiqpment
Basic information of Reflow Oven RF-1010I Equipment
|PCB Conveyor Method||Mesh and Rails|
|Mesh Width||450 MM|
|Cooling Method||Air Oven : Forced Air;
Nitrogen Oven : Water Chiller
|No. of Cooling Zones||2|
|Dimension ( L*W*H )||5700*1300*1450|
|Normal Operation Power||About 11KW|
|Temperature Deviation on PCB||± 1.5C|
|Conveyor Height||900± 20 MM|
|No. of Heating Zones||Top10 & Bottom 10|
|Components Clearance||Top / Bottom Clearance of PCB is 25mm|
|Temperature Control Precision||± 1C|
|Convryor Speed||20-2000MM/ min|
|Length of Heating Zones||3650 MM|
|Temp. Setting Range||Rome Temperature ~320C|
Product Introduction of Reflow Oven
Series lead-free reflow oven changdian's mature product after years of market testing.
Series Reflow oven has maintained a larger share of the market for many years.
Its unparalleled heating performance and temperature control system meets the
requirements of various welding processes.
It is changdian's crystallization of years technical research and development. Series
Lead-free reflow is high-end reflow products committed to keeping up with market
demand to enhance customers competitiveness.Its new design concept fully meets
the needs of increasingly diverse processes, And considering the future direction of
the industry, entirely suitable for communications, automotive electronics,
home appliances, computers and other consumer electronic products.
What‘s the Reflow Oven
Reflow oven is one of the three main processes in the SMT placement process.
Reflow oven is mainly used for soldering circuit boards with mounted components.
The solder paste is melted by heating to fuse the chip components and the circuit
board pads, and then the solder paste is cooled by reflow oven to cool the components
and The pads are cured together.
Photos of Reflow Oven Equipment RF-1010I
Packing Method : Vaccum package
Contact Person: Ivan Zhu