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Product Details:
Payment & Shipping Terms:
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| Model: | RF-800I | Nozzle Plate: | Stainless Steel Plate |
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| Cooling Method: | Air Oven : Forced Air; Nitrogen Oven : Water Chiller | Components Clearance: | Top / Bottom Clearance Of PCB Is 25mm |
| No. Of Cooling Zones: | 2 | Length Of Heating Zones: | 2950 MM |
| Conveyor Speed: | 20-2000MM/min | Mesh Width: | 450MM |
| High Light: | 8 Zone Reflow Oven,380V 8 Zone Reflow Oven,380V Reflow Oven Machine |
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380V 220V Lead Free 8 Zone Reflow Oven PCB Assembly Line Machine
Custom Lead Free 8 Zones Reflow Oven Equipment Machine For Assembly Line
Product instructions of Reflow Oven Equipment
★ Simple: combined with advanced international concepts, based on the Oriental-designed operating system, easy to understand, easy to learn, easy to maintain.
★ Hedging: Import hardware configuration,low failure rate in production,more than a decade service life.
★ Safety: Based on the general rules of international design, close to imported reflow rating, the highest security level.
★ Stable: mature software, hardware and top production processes ensures stability of each equipment.
★ Expertise: learn imported reflow oven's advanced design concepts, and the machine core components are using imported top brands.
The Advantage of Reflow Oven
■ Corresponding to high-performance welding requirements
■ Oxygen-free environment for preheating and welding process
■ Temperature consistency of the entire welding assembly
■ Overheating will never happen
■ No shadow phenomenon
■ Single board can be welded multiple times
■ Ultra-low operating cost
■ Flexible versatility and independent operation
The Specification Date of Reflow Oven RF-800I
| Model | RF-800I |
| Nozzle Plate | Stainless Steel Plate |
| Cooling Method | Air Oven : Forced Air; Nitrogen Oven : Water Chiller |
| Components Clearance | Top / Bottom Clearance of PCB is 25mm |
| No. of Heating Zones | Top 8 & Bottom 8 |
| No. of Cooling Zones | 2 |
| Length of Heating Zones | 2950 MM |
| Conveyor Direction | Option |
| Conveyor Speed | 20-2000MM/min |
| Mesh Width | 450 MM |
| Power Supply | 380V 50HZ / 220V 60HZ |
| Temp. Setting Range | Rome Temperature ~320C |
| Temperature Control Precision | ± 1C |
| Temperature Deviation on PCB | ± 1.5C |
| Weight | 1800KG |
| Max. Width of PCB | 50 ~ 400 MM |
| Conveyor Height | 900± 20 MM |
| PCB Conveyor Method | Mesh and Rails |
| Startup Power | Approx. 33KW |
| Normal Operation Power | About 9KW |
| Dimension ( L*W*H ) | 5000*1300*1450 |
Picture Showing of Reflow Oven
Classification of reflow soldering
1) According to the heating area of reflow soldering, it can be divided into two categories: one is to reflow the PCB as a whole, and the other is to reflow the PCB locally.
2) The heating and reflow soldering of the PCB as a whole can be divided into: hot plate reflow soldering, infrared reflow soldering, hot air reflow soldering, hot air plus infrared reflow soldering, and gas phase reflow soldering.
3) The partial heating and reflow soldering of PCB can be divided into: laser reflow soldering, focused infrared reflow soldering, beam reflow soldering, and hot air flow reflow soldering.
Contact Person: Ivan Zhu
Tel: 86-13534290911
