Payment & Shipping Terms:
|Name:||Reflow Oven RF-H800I||Characteristic:||Lead Free New Type Reflow Oven|
|Size:||5150*1490*1510 (mm)||Weight:||About 2100kg|
|Cooling Zone:||600 Mm Length||Cooling Type:||Forced-air Coooling|
|Temp Deviation:||± 2C||Heating Zone:||2932mm Length|
8 Zones SMT Reflow Oven Machine,
Forced Air Cooling SMT Reflow Oven,
Lead Free SMT Reflow Soldering Oven
Lead Free Hot Air SMT Reflow Oven
Lead Free 8 Heating Zones SMT Machine Reflow Oven Equipment for Production Line
The Features of 8 Zones Reflow Oven Equipemnt:
1. Special high temperature resistant protection system (the United States of America's high density insulation rock wool in heat preservation system and special iron in furnace. It suit for lead free welding and the welding area with rosin flux recovery system to protect environment.
2. Using imported Taiwan SanYue long axis of high temperature fan motor.
3. Using Fanda thermocouple imported from Taiwan by each temperature zone, it can fast and sensitive induct the changes in each temperature zone, transfer and control timely, compensate the temperature balance in each zone.
4. Special SSR solid state relay matched with dedicated radiator improve the heat efficiency greatly and prolong the service time effectively. No contact output and the fuzzy control function by thermostat, can monitoring the changes in the outside temperature and calorific value, controlling the heating device by the minimum pulse, ensuring the high precision of temperature control & the uniform temperature in internal and the length, direction, temperature distribution, all of these meet IPC standard.
The principle of reflow soldering is divided into several descriptions:
A. When the PCB enters the heating zone, the solvent and gas in the solder paste evaporate, and at the same time, the flux in the solder paste wets the pads, component ends and pins, and the solder paste softens, collapses, and covers the solder The pads isolate the pads and component pins from oxygen.
B. When the PCB enters the heat preservation zone, the PCB and components are fully preheated to prevent the PCB from suddenly entering the welding high temperature zone and damaging the PCB and components.
C. The PCB enters the cooling zone and the solder joints are solidified; when the reflow soldering is completed.
Parameter of Reflow Oven RF-H800I
|Running / Starting Power||8.5 / 33 kw|
|Control||PLC + PC|
|Temp Accuracy||± 1C|
|Conveyor Type||Chain and Mesh Belt|
|Conveyor Speed||20-1500 mm/min|
|Heating Zone Length||2932 mm|
|Power Supply||3P/AC 380V OR 3P/AC 220V|
|Temp Deviation||± 2C|
|Machine Dimension||5150*1490*1510 (mm)|
|Parts Height||On Baoard 35mm / Under Board 20mm|
|Cooling Type||Forced-air Coooling|
|Mesh Belt Width||460 mm|
|PCB Width||50 - 400mm|
|Temp Range||Room Temperature ~ 320C|
|Cooling Zone length||600 mm|
Detailed picture of reflow oven 8 zones
Packing method of Reflow Oven
Contact Person: Ivan Zhu